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Dongguan Xingqiang Circuit Board Technology Co., Ltd.
Dongguan Xingqiang Circuit Board Technology Co., Ltd.
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Rigid-Flex PCB ENIG Surface FR-4 & PI Substrate Low Resistance OEM/ODM Service

Dongguan Xingqiang Circuit Board Technology Co., Ltd.
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Rigid-Flex PCB ENIG Surface FR-4 & PI Substrate Low Resistance OEM/ODM Service

Brand Name : High Frequency PCB

Place Of Origin : China

Certification : ISO 9001 / RoHS /UL / IATF 16949 (automotive)

MOQ : Sample,1 Pc(5 Square Meters)

Price : Based on Gerber Files

Delivery Time : NA

Payment Terms : T/T,Western Union

Supply Ability : 100000㎡/Month

Model Number : As Per Customer's Model

Product Name : Custom High-Frequency PCB

Min Holes Size : 0.1mm

Min.Line Spacing : 3mil

Copper Overall : 0.5-5oz

Min.Line Width : 0.075mm

Layers : 1-30 Layers

SMT Technique : SMD, BGA, DIP, Etc.

Quotation Request : Gerber Or BOM List

Silkscreen : White,Black,Yellow,Red

Solder Mask Color : Green,Red,Black,White,Blue,Yellow

Standard Board Thickness : 1.6/1.2/1.0/0.8mm or Customized

Features : High density,Corrosion resistant,Flame retardant

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What we can do?:

This custom rigid-flex PCB by XingQiang PCB Technology is engineered for wearable devices like smart watches & fitness trackers, adopting High Tg FR-4 rigid substrate + PI flexible material with ENIG gold-plated surface. Boasting ISO-certified quality, high integration, bendable design and anti-oxidation performance, it ensures stable signal transmission. With 30+ years of precision manufacturing, one-stop service and premium raw materials, we offer OEM/ODM customization per your exact model and design requirements for mass production.


What are the advantages of high-frequency PCB boards?:

1.Rigid-flex structure (High Tg FR-4 + PI), bendable & space-saving
2. ENIG gold-plated surface, oxidation/corrosion resistant
3. High-density multi-layer, 94V-0 flame retardant, high integration
4. Precise impedance control, stable medium-low frequency signal transmission
5. Customizable size/design, compatible with SMT precision soldering


Rigid-Flex Circuit Board Manufacturing Process:

XingQiang’s custom rigid-flex PCB production flow:

1. Receive customer’s Gerber design/drawing for technical confirmation & optimization.

2. Material cutting (High Tg FR-4/PI).

3. Rigid-flex layer processing: circuit imaging, etching, plating.

4. Lamination & pressing to form integrated structure.

5. Drilling, ENIG surface treatment, solder mask printing.

6. Precision testing (impedance, connectivity, bend performance).

7. Sample confirmation, mass production & final inspection, then delivery.

All steps follow strict quality control, matching your exact model requirements.



Rigid-Flex PCB ENIG Surface FR-4 & PI Substrate Low Resistance OEM/ODM Service

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Rigid-Flex PCB ENIG Surface FR-4 & PI Substrate Low Resistance OEM/ODM Service


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Rigid-Flex PCB ENIG Surface FR-4 & PI Substrate Low Resistance OEM/ODM Service


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Rigid-Flex PCB ENIG Surface FR-4 & PI Substrate Low Resistance OEM/ODM Service



Rigid-Flex PCB ENIG Surface FR-4 & PI Substrate Low Resistance OEM/ODM Service


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